This
connector is designed for fine pitch applications while
maintaining the optimum flex characteristics common to other
types of Nippon Heat Seal Connectors. Through proprietary
technologies involving paste formulation in combination
with printing processes, Nippon Graphite Industries has
made it possible to screen print the micro pitched traces
of polymer thick film pastes and hot melt thermoset adhesives
on polyester film to make flexible circuitry with heat seal
termination. Electrical termination are made without solder,
clamps or elastomeric connectors.
As the
market grows for minimisation using micro scaled products,
the electronics industry is being called upon for further
research and development to satisfy these demands. This
is particularly true where advanced surface mounting technologies
maintain its trends towards higher densities, that in turn
require new connector technology.
The
Monosotropic Heat Seal Connector redefines the meaning of
high density interconnects. The conventional Anisotropic
type preceded the Monosotropic type and is in general use
for lower density termination. It has microscopic metal
particles within the Hot Melt Adhesive covering the entire
area being terminated including the spaces as well as the
traces. The Monosotropic type confines those metal particles
exclusively to the conductive traces thereby overcoming
problems that fine pitches cause.
Each
application is unique. For details on using Monosotropic
Heat Seal Connectors in your application, please contact
Colin Surgison here at Challenger Components or complete
the online request form. This form can only be used if standard
parallel traces are required. For non-standard requirements,
please contact Colin Surgison. Alternatively you can visit
www.iteourope.com.
